Through Hole Technology

TMG Electronics is ready to meet your electronic manufacturing services needs with a wide range of capabilities that add value to your product. One of those capabilities is our through hole (TH) technology assembly capability which can handle both leaded and lead-free applications.

You'll find that TMG Electronics offers fully equipped services for handling all types of through hole components. Axial and radial-leaded through hole components are inserted using our Univeral Instruments automatic insertion machines.Dual-inline-packaged (DIP) integrated circuits are also inserted automatically using our Universal Instruments DIP Inserter.

Our through hole technology assembly operations are supported by our, 80-station, Universal axial-lead component sequencer for optimal performance in meeting your through hole assembly needs.

MBG's through hole operations also utilize state-of-the-art component prep equipment that support two, highly flexible manual insertion lines. Electrovert Wave Soldering futher complements our through hole assembly processess. Our Vitronics Selective Soldering process is our latest addition to our automated through hole operations, enabling MTI to be completely RoHS compliant with dual lead-free and leaded capability.

More about Through Hole Technology.

What exactly is through hole technology? There are two basic methods for mounting a component to a printed circuits board, the first is called surface mount assembly (click here for more information) and the second method is called through hole technology (abbreviated "TH"). While a surface mount literally affixes the component to the top surface of the board, through hole attaches the component to the board by providing holes in the board to allow the component lead to go through the board and exit the opposite side of the board. From here the leads are soldered to the copper track completing the circuit.

The diagram on the right illustrates what a through hole assembly on a printed circuit board looks like.